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首页> 外文期刊>Journal of Materials Engineering and Performance >Wetting, Interfacial Interactions, and Vacuum Metallization of SnO(2)Ceramics by Liquid Metals and Alloys
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Wetting, Interfacial Interactions, and Vacuum Metallization of SnO(2)Ceramics by Liquid Metals and Alloys

机译：液体金属和合金的SnO（2）陶瓷的润湿，界面相互作用和真空金属化

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摘要

The wetting behavior of SnO2-ceramic substrates with metallic melts, such as Au, Ag, Cu, Sn, Ga, Pb, Ni, Al, Ge, Ag-Cu, Ag-Ge, Ag-Si, Cu-Si, Cu-Ni, Cu-Ge, Cu-Sn, Ag-Ti, Sn-Ti, Ag-Cu-Ti, and Cu-Sn-Ti in vacuum, was investigated. Wetting experiments at high temperatures (1270-1370 K) were carried out using sessile drop method with two types of SnO(2)ceramics: low-density pure SnO2, and high-density SnO(2)with 1 wt.% Fe2O3. Molten copper and its alloys with high Cu-concentration, such as Cu-Ag, Cu-Sn, and Cu-Ni, wet the ceramics, because SnO(2)decomposes during heating in vacuum, resulting in formation of oxygen, which dissolves in the melt and acts as an adhesion-active additive. The dependence of the contact angle on the composition of the melt for various binary alloys (Ag-Cu, Ag-Si, Ag-Sn, Cu-Ni, Cu-Sn, and Cu-Si) was investigated. The results showed that the Cu-Ni system is the most promising filler for metallization and vacuum brazing of SnO(2)ceramics. A method of vacuum metallization, using Cu-Ni filler, resulting in strong adhesion of coatings, which are uniformly deposited on the SnO(2)ceramic surface, is proposed.
机译：具有金属熔体的SnO2陶瓷基材的润湿行为，如Au，Ag，Cu，Sn，Ga，Pb，Ni，Al，Ge，Ag-Cu，Ag-Ge，Ag-Si，Cu-Si，Cu-研究了Ni，Cu-Ge，Cu-sn，Ag-Ti，Sn-Ti，Ag-Cu-Ti和真空中的Cu-Sn-Ti。使用两种类型的SnO（2）陶瓷（2）陶瓷的无柄液滴法进行高温（1270-1370 k）的润湿实验：低密度纯SnO2，高密度SnO（2），具有1wt％的Fe2O3。熔融铜及其具有高Cu浓度的合金，如Cu-Ag，Cu-Sn和Cu-Ni，润湿陶瓷，因为SnO（2）在真空加热过程中分解，导致氧气形成，溶解熔体和用作粘附活性添加剂。研究了接触角对各种二元合金的熔体组成（Ag-Cu，Ag-Si，Ag-Sn，Cu-Ni，Cu-Sn和Cu-Si）的依赖性。结果表明，Cu-Ni系统是用于金属化和SnO（2）陶瓷的金属化和真空钎焊的最有前景的填充剂。提出了一种使用Cu-Ni填料的真空金属化方法，得到了均匀地沉积在SnO（2）陶瓷表面上均匀沉积的涂层的强粘附。

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