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首页> 外文期刊>Journal of Nondestructive Evaluation >Quantitative Simultaneous Determination for Young's Modulus and Adhesion of Low-k Thin Film by Non-destructive CZM-SAW Technique
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Quantitative Simultaneous Determination for Young's Modulus and Adhesion of Low-k Thin Film by Non-destructive CZM-SAW Technique

机译：非破坏性CZM锯技术的杨氏模量和低k薄膜粘合的定量同时测定

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摘要

Adhesion and Young's modulus are of great interest in thin film science because these two properties are the most vital factors in determining the durability and stability of the device. Insufficient Young's modulus and adhesion property are the most serious problems encountered in the application of low-k thin film which is widely used in microelectronic industry. In this study, the nondestructive surface acoustic wave (SAW) technique with cohesive zone model (CZM) is employed to determine the quantitative thin film Young's modulus and adhesion simultaneously. By studying the influence of film adhesion on the determination of film Young's modulus, a film adhesion and Young's modulus simultaneous measuring method is proposed. Based on the original CZM-SAW technique, comprehensive matching process is executed in this simultaneous measuring method. By this method, interactive effects of these two parameters are taken into consideration in the determining process so that more accurate adhesion and Young's modulus results can be acquired. In this paper, the adhesion and Young's modulus of SiO2 films and porous Black Diamond film are measured by the CZM-SAW technique. This study presents a high-precision measuring method for film adhesion and Young's modulus. This paper also shows the promising advantages of the CZM-SAW technique in characterization of thin film properties.
机译：粘附和杨氏模量对薄膜科学感兴趣，因为这两个性质是确定装置的耐用性和稳定性最重要的因素。杨氏模量不足和粘附性是在微电子行业广泛应用的低k薄膜应用中遇到的最严重的问题。在该研究中，采用具有粘结区模型（CZM）的非破坏性表面声波（SAW）技术，以同时测定定量薄膜杨氏模量和粘附。通过研究膜粘附对薄膜杨氏模量的测定的影响，提出了膜粘附和杨氏模量的同时测量方法。基于原始CZM-SAW技术，在这种同时测量方法中执行全面的匹配过程。通过该方法，在确定过程中考虑这两个参数的交互式效果，从而可以获得更准确的粘合和杨氏模量结果。本文通过CZM锯技术测量了SiO2薄膜和多孔黑金刚石膜的粘附和杨氏模量。本研究提出了一种高精度测量方法，用于胶片粘附和杨氏模量。本文还示出了CZM-SAW技术在表征薄膜特性方面的有前途优势。

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