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首页> 外文期刊>Металлофизка и новейшие технологии(на укр., рус. и анг. языках) >Development of Materials and New Methods of Forming of Defectless and Corrosion Resistant Metallization of the Large-Scale Integrated Circuits
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Development of Materials and New Methods of Forming of Defectless and Corrosion Resistant Metallization of the Large-Scale Integrated Circuits

机译:大规模集成电路的缺陷和耐腐蚀金属化材料的研制和新方法

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摘要

Salient features of corrosion damage of aluminiummetallization of large-scale integrated (LSI) circuits areexperimentally and theoretically studied. It is shown that a processof corrosion attack slows down and stops by the introduction ofrare-earth metals into the aluminium alloy or by the ion-implantation modification of its surface. On basis of investigations,new materials and methods of non-corrosive metallization of LSIcircuits are elaborated.
机译:大规模集成(LSI)电路铝合金化腐蚀损伤的凸起特征及理论研究。 结果表明,腐蚀攻击的过程减慢并通过将地球金属引入铝合金或通过其表面的离子植入改性来停止。 在研究的基础上,详细阐述了Lsicircuits的非腐蚀金属化的新材料和方法。

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