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Developing high-performance laminated Cu/TiC composites through melt infiltration of Ni-doped freeze-cast preforms

机译:通过熔融渗透的Ni掺杂的冷冻铸件锻炼开发高性能层压Cu / TiC复合材料

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摘要

Nacre-inspired laminated composites have been proven to possess a unique combination of strength and toughness. In this study, we fabricated nacre-mimetic Cu/TiC composites via unidirectional freezing of aqueous TiC slurries containing different amounts of NiO additives, followed by ice sublimation, carbothermal reduction of NiO to Ni during sintering and then gas-pressure infiltration of the Cu melt. The introduction of Ni greatly facilitated the densification of ceramic lamellae and enhanced the interfacial bonding between Cu and TiC. The resultant composites displayed outstanding damage tolerance and anisotropic electrical conductivities. Specifically, for an similar to 31 vol% TiC-Cu composite containing 24 wt% Ni in the ceramic lamellae (based on the TiC content), a fracture toughness (K-Jc) of 72.5 +/- 1.0 MPa.m(1/2), work of fracture of 53.4 +/- 3.5 kJ/m(2), bending strength of 725 +/- 11 MPa and longitudinal electrical conductivity of 22.7 MS/m (similar to 60% of the Cu matrix) were achieved, which were approx. 81%, 536%, 122% and 97% higher than those of the Ni-free composite, respectively. Noticeable toughening was demonstrated to be a consequence of multiple cracking, plastic deformation and uncracked-ligament bridging of the metal layers, as well as crack deflection and blunting. On the other hand, significant strengthening resulted from tailoring the microstructures in the ceramic layers and at the Cu/TiC interface as a result of Ni doping. We believe that the facile strategy adopted herein provides an effective way to solve the problems of wetting and bonding related to metal infiltration and can be readily extended to the preparation of other nacre-inspired metal - ceramic composites.
机译:已经证明了珍珠化的层压复合材料具有独特的力量和韧性结合。在这项研究中,我们通过单向冷冻含有不同量的NiO添加剂的含水TiC浆料,然后进行冰升华,在烧结过程中,NiO对Ni的水热量减少,然后Cu熔化的气压浸润的冰升华,然后Cu熔化的冰水浸润。 NI的引入极大地促进了陶瓷薄片的致密化,并增强了Cu和Tic之间的界面键合。得到的复合材料显示出突出的损坏公差和各向异性电导率。具体地,对于陶瓷薄片(基于TIC含量)的含有24wt%Ni的31Vol%TiC-Cu复合材料,骨折韧性(K-JC)为72.5 +/- 1.0MPa.m(1 / 2),骨折工作53.4 +/- 3.5 kJ / m(2),弯曲强度为725 +/-11MPa和纵向电导率为22.7ms / m(类似于Cu基质的60%),这是约。比无Ni复合材料的81%,536%,122%和97%高。显着的增韧被证明是金属层的多个裂缝,塑性变形和未粘合的韧带桥接的结果,以及裂纹偏转和钝化。另一方面,由于Ni掺杂,从剪裁陶瓷层中的微观结构和Cu / TiC界面的显着强化产生了显着的强化。我们认为,本文采用的面部策略提供了解决与金属浸润相关的润湿和粘合问题的有效方法,并且可以容易地延伸到制备其他珍珠酒的金属陶瓷复合材料。

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