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首页> 外文期刊>ACS nano >Enhanced Reduction of Thermal Conductivity in Amorphous Silicon Nitride-Containing Phononic Crystals Fabricated Using Directed Self-Assembly of Block Copolymers
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Enhanced Reduction of Thermal Conductivity in Amorphous Silicon Nitride-Containing Phononic Crystals Fabricated Using Directed Self-Assembly of Block Copolymers

机译：使用指向嵌段共聚物的定向自组装制造的无定形氮化硅含有声音晶体中的导热率的降低

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Studies have demonstrated that the thermal conductivity (kappa) of crystalline semiconductor materials can be reduced by phonon scattering in periodic nanostructures formed using templates fabricated from self-assembled block copolymers (BCPs). Compared to crystalline materials, the heat transport mechanisms in amorphous inorganic materials differ significantly and have been explored far less extensively. However, thermal management of amorphous inorganic solids is crucial for a broad range of semiconductor devices. Here we present the fabrication of freestanding amorphous silicon nitride (SiNx) membranes for studying kappa in an amorphous solid. To form a periodic nanostructure, directed self-assembly of cylinder-forming BCPs is used to pattern in the SiNx highly ordered, hexagonally close packed nanopores with pitch and neck width down to 37.5 and 12 nm, respectively. The kappa of the nanoporous SiNx membranes is 60% smaller than the classically predicted value based on just the membrane porosity. In comparison, holes with much larger neck widths and pitches patterned by e-beam lithography lead to only a slight reduction in kappa, which is closer to the classical porosity-based prediction. These results demonstrate that kappa of amorphous Si/N-x can be reduced by introducing periodic nanostructures that behave as a phononic crystal, where the relationship between the smallest dimension of the nanostructure and the length scale of the mean-free paths of the dominant, heat-carrying phonons is critical. Additionally, changing the orientation of the hexagonal array of nanopores relative to the primary direction of heat flow has a smaller impact on amorphous SiNx than was previously observed in silicon.
机译：研究表明，使用由自组装嵌段共聚物（BCPS）制造的模板形成的周期性纳米结构中的晶体半导体材料的导热率（Kappa）可以减少。与结晶材料相比，无定形无机材料中的热传输机制显着差异，并且已经广泛探讨了。然而，非晶无机固体的热管理对于广泛的半导体器件至关重要。在这里，我们介绍了独立式非晶硅氮化硅（SINX）膜的制造，用于研究无定形固体中的Kappa。为了形成周期性的纳米结构，将圆柱形BCP的定向自组装用于在高度有序的六角形关闭填充纳米孔中的基辛，分别下降至37.5和12nm。基于膜孔隙率的纳米孔SINX膜的Kappa比经典预测值小60％。相比之下，通过电子束光刻图案化的颈部宽度和俯仰具有更大较大的孔，其仅导致κB的轻微减少，这是更接近经典孔隙率的预测。这些结果表明，通过引入所示作为声子晶体的周期性纳米结构可以减少无定形Si / Nx的κ，其中纳米结构的最小尺寸与显性，热的不平移路径之间的关系。携带声子是至关重要的。另外，改变六边形阵列相对于热流的主方向的六边形阵列的取向对非晶SINX的影响较小，而不是在硅中观察到的。

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