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Insight into the Directional Thermal Transport of Hexagonal Boron Nitride Composites

机译：洞察六边形氮化硼复合材料的定向热传输

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摘要

Ideal dielectric materials for microelectronic devices should have high directionally tailored thermoconductivity with low dielectric constant and loss. Hexagonal boron nitride (hBN) with excellent thermal and dielectric properties shows a promise for the fabrication of thermoconductive dielectric polymer composites. Herein, a simple method for the fabrication of lightweight polymer/hBN composites with high directionally tailored thermoconductivity and excellent dielectric properties is presented. The solid polymer/hBN composites are manufactured by melt-compounding and injection molding. The porous composites are successfully manufactured in an injection molding process through supercritical fluid (SCF) foaming. X-ray tomography provides direct visualization of the internal microstructure and hBN orientation, leading to an in-depth understanding of the directionally dependent thermoconductivity of the polymer/hBN composite. Shear-induced orientation of hBN platelets in the solid HDPE/hBN composites leads to a significant anisotropic thermal conductivity. The solid HDPE/23.2 vol % hBN composites show an in-plane thermoconductivity as high as 10.1 W m~(–1) K~(–1), whereas the through-plane thermoconductivity is limited to 0.28 W m~(–1) K~(–1). However, the generation of a porous structure via SCF foaming imparts in situ exfoliation, random orientation, and interconnectivity of hBN platelets within the polymer matrix. This results in highly isotropic thermoconductivity with higher bulk thermal conductivity in the lightweight porous composites as compared to their solid counterparts. Furthermore, the electrically insulating composites developed in this study exhibit low dielectric constant and ultralow dielectric loss. Thus, this study presents a simple fabrication method to develop lightweight dielectric materials with tailored thermal conductivity for modern electronics.
机译：用于微电子器件的理想介电材料应具有高介电常数和损耗的高定向定制的导热性。具有优异的热和介电性质的六边形氮化硼（HBN）表示了制造热导电介质聚合物复合材料的承诺。这里，提出了一种用于制造具有高定向定制的导热性和优异介电性能的轻质聚合物/ HBN复合材料的简单方法。固体聚合物/ HBN复合材料通过熔融配混和注塑制造。通过超临界流体（SCF）发泡，在注射成型过程中成功制造多孔复合材料。 X射线断层扫描提供内部微观结构和HBN取向的直接可视化，从而深入了解聚合物/ HBN复合材料的定向依赖性导热性。固体HDPE / HBN复合材料中HBN血小板的剪切诱导的取向导致显着的各向异性导热率。固体HDPE / 23.2 Vol％HBN复合材料显示出高达10.1W m〜（-1）K〜（-1）的面内导热性，而贯通平面导热性限制为0.28W m〜（-1） K〜（-1）。然而，通过SCF发泡产生多孔结构，赋予聚合物基质内HBN血小板的原位剥离，随机取向和互连。与它们的固体对应物相比，这导致轻质多孔复合材料中具有更高的体热导率的高各向同性的热导率。此外，本研究中开发的电绝缘复合材料表现出低介电常数和超级介电损耗。因此，该研究提出了一种简单的制造方法，用于开发具有用于现代电子的量身定制的导热系数的轻质介电材料。

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