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首页> 外文期刊>Experimental Thermal and Fluid Science: International Journal of Experimental Heat Transfer, Thermodynamics, and Fluid Mechanics >Thermal and gas flow characterization of a fluxless Si solder bonding oven
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Thermal and gas flow characterization of a fluxless Si solder bonding oven

机译：无助焊剂硅焊锡炉的热和气流特征

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摘要

In this paper the technology of the " Linn" type Si fluxless solder bonding oven and the thermal and gas flow characterization of the oven are discussed. This oven is used for fixing silicon chips on metal substrates with high temperature solder bonding process. The solder is applied in a foil form which is placed between the Si chip and the metal substrate. This does not contain any flux, therefore a reducing agent has to be applied to avoid the oxidation of the joints during the soldering process. In this technology the reducing agent is the forming gas which is a mixture of 10vol.% H_2 and 90vol.% N_2. The key factors of this soldering process was studied; the suitable temperature (350-370°C for 13-15min) and the adequate H_2 concentration (8-10vol.%). A detailed 3D gas flow model of the Linn oven was prepared which is based on the finite volume model (FVM) method. The gas flow circumstances using the basic and a hypothetic oven setting were compared by simulations applied the ANSYS-FLUENT system. The gas flow model was verified by the measurements of the temperature, the H_2 concentration and the pressure inside the oven. Furthermore the heating ability of the oven under full load was characterized by the change of the heating temperature and the time coefficient of the heating.
机译：本文讨论了“ Linn”型硅无助焊剂焊接炉的技术以及该炉的热和气流特性。该烤箱用于通过高温焊接工艺将硅芯片固定在金属基板上。焊料以箔片形式施加，该箔片放置在Si芯片和金属基板之间。它不含任何助焊剂，因此必须使用还原剂以避免焊接过程中接头的氧化。在该技术中，还原剂是形成气体，其为10体积％的H_2和90体积％的N_2的混合物。研究了这种焊接过程的关键因素。合适的温度（350-370°C持续13-15分钟）和适当的H_2浓度（8-10vol。％）。基于有限体积模型（FVM）方法，准备了Linn烤箱的详细3D气流模型。使用ANSYS-FLUENT系统进行的模拟比较了使用基本设置和假设设置的烤箱的气流情况。通过测量温度，H_2浓度和炉内压力来验证气流模型。此外，烤箱在满负荷下的加热能力通过加热温度和加热时间系数的变化来表征。

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