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首页> 外文期刊>Global SMT & Packaging: European Edition (Surface Mount Technology) >Conductive crystals, white residues, and decreased reliability - The rush to clean no-clean
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Conductive crystals, white residues, and decreased reliability - The rush to clean no-clean

机译：导电晶体，白色残留物并降低可靠性-急于清洗免清洗

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摘要

Just as the little girl in the 1982 film Poltergeist eerily exclaimed, "they're back," the electronics assembly industry "has witnessed the return of a familiar yet unappreciated process step: cleaning. Once commonplace, then relegated to military and other high reliability applications, today defluxing has once again moved toward the mainstream. The miniaturization of electronic assemblies and their components, implementation of lead-free alloys, combined with improved quality standards and higher reliability expectations have culminated to form a growing demand for ironically clean electronic circuits. This paper will review the major causes of residue-related failures including dendritic growth, electrical leakage, and under-coating adhesion failures. Why we clean, what we are removing, and how clean is clean will be presented.
机译：就像1982年电影《 Poltergeist》中的小女孩大声疾呼：“他们回来了”，电子装配行业“目睹了一个熟悉而又不为人所知的工艺步骤的回归：清洁。在应用领域中，如今的除焊剂已再次成为主流，电子组件及其组件的小型化，无铅合金的实现，质量标准的提高以及对可靠性的更高期望，最终导致了对具有讽刺意味的清洁电子电路的需求不断增长。本文将回顾与残留相关的故障的主要原因，包括树突状生长，漏电和底漆附着力故障，并介绍清洁原因，清除方法以及清洁方法。

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