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首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >Effect of Bonding Temperature on Phase Transformation of Diffusion-Bonded Joints of Duplex Stainless Steel and Ti-6Al-4V Using Nickel and Copper as Composite Intermediate Metals
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Effect of Bonding Temperature on Phase Transformation of Diffusion-Bonded Joints of Duplex Stainless Steel and Ti-6Al-4V Using Nickel and Copper as Composite Intermediate Metals

机译：结合温度对以镍和铜为复合中间金属的双相不锈钢和Ti-6Al-4V扩散结合接头相变的影响

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In the present study, the effect of bonding temperature on phase transformation of diffusion-bonded joints of duplex stainless steel (DSS) and Ti-6Al-4V (Ti64) using simultaneously both nickel (Ni) and copper (Cu) interlayers was investigated in the temperature range of 1148 K to 1223 K (875 degrees C to 950 degrees C) insteps of 25 K (25 degrees C) for 60 minutes under 4 MPa uniaxial pressure in vacuum. Interfaces were characterized by scanning electron microscopy and interdiffusion of the chemical species across the diffusion interfaces were witnessed by electron probe microanalysis. At 1148 K (875 degrees C), layer-wise Cu4Ti, Cu2Ti, Cu4Ti3, CuTi, and CuTi2 phases were observed at the Cu-Ti64 interface; however, DSS-Ni and Ni-Cu interfaces were free from any intermetallic. At 1173 K and 1198 K (900 degrees C and 925 degrees C), Cu interlayer could not restrict the diffusion of atoms from Ti64 to Ni, and vice versa; and Ni-Ti-based intermetallics were formed at the Ni-Cu interface and throughout the Cu zone as well; however, at 1223 K (950 degrees C), both Ni and Cu interlayers could not inhibit the diffusion of atoms from Ti64 to DSS, and vice versa. The maximum shear strength of similar to 377 MPa was obtained for the diffusion couple processed at 1148 K (875 degrees C) and strength of the bonded joints gradually decreased with the increasing bonding temperature due to the widening of brittle intermetallics at the diffusion zone. Fracture path indicated that failure took place through the Cu4Ti intermetallic at the Cu-Ti64 interface when bonding was processed at 1148 K (875 degrees C). When bonding was processed at 1173 K and 1198 K (900 degrees C and 925 degrees C), fracture took place through the Ni3Ti intermetallic at the Ni-(Ni+Cu+Ti64 diffusion reaction) interface; however, at 1223 K (950 degrees C), fracture morphology indicated the brittle nature and the fracture took place apparently through the sigma phase at the DSS-(DSS+Ni+Cu+Ti64 diffusion reaction) interface. (C) The Minerals, Metals & Materials Society and ASM International 2015
机译：在本研究中，研究了结合温度对同时使用镍（Ni）和铜（Cu）中间层的双相不锈钢（DSS）和Ti-6Al-4V（Ti64）扩散结合接头的相变的影响。在真空下4 MPa单轴压力下，温度范围1148 K到1223 K（875摄氏度到950摄氏度）以25 K（25摄氏度）升高60分钟。通过扫描电子显微镜对界面进行表征，并通过电子探针显微分析来观察化学物种在扩散界面上的相互扩散。在1148 K（875摄氏度）下，在Cu-Ti64界面处观察到分层的Cu4Ti，Cu2Ti，Cu4Ti3，CuTi和CuTi2相。但是，DSS-Ni和Ni-Cu界面不含任何金属间化合物。在1173 K和1198 K（900摄氏度和925摄氏度）下，Cu中间层不能限制原子从Ti64扩散到Ni，反之亦然;在Ni-Cu界面以及整个Cu区也形成了Ni-Ti基金属间化合物。但是，在1223 K（950摄氏度）下，Ni和Cu中间层都不能抑制原子从Ti64扩散到DSS，反之亦然。对于在1148 K（875摄氏度）下加工的扩散偶，获得的最大剪切强度接近377 MPa，并且由于扩散区脆性金属间化合物的加宽，结合接头的强度随着结合温度的升高而逐渐降低。断裂路径表明，当在1148 K（875摄氏度）下进行键合处理时，会通过Cu-Ti64界面处的Cu4Ti金属间化合物发生破坏。当在1173 K和1198 K（900℃和925℃）下进行键合时，在Ni-（Ni + Cu + Ti64扩散反应）界面处通过Ni3Ti金属间化合物发生断裂。然而，在1223 K（950摄氏度）下，断裂形态表明其脆性，并且断裂显然是通过DSS-（DSS + Ni + Cu + Ti64扩散反应）界面的σ相发生的。 （C）矿物，金属和材料学会和ASM International 2015

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