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Chemical modification of gate dielectric surfaces in organic thin film transistior (OTFT) Through molecular self-assembly

机译:通过分子自组装对有机薄膜晶体管(OTFT)中的栅极介电表面进行化学修饰

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摘要

To modify SiO_2 dielectric surface of bottom-contact OTFT device, octadecyltriethoxysilane (OTES) was used to find optimum condition of surface modification for triethoxysilane derivatives. Either spin-coating method or solution dipping method was applied to modify the dielectric surface with OTES. Optimization process was performed with varying solution concentration, reaction time and so on. Through surface modification of OTFT, 0.01-0.04 cm~2/V/s of hole mobilities were observed depending on modification conditions.
机译:为了修饰底部接触OTFT器件的SiO_2介电表面,使用十八烷基三乙氧基硅烷(OTES)寻找三乙氧基硅烷衍生物的表面修饰的最佳条件。采用旋涂法或溶液浸渍法,用OTES改性介电表面。在改变溶液浓度,反应时间等条件下进行了优化过程。通过OTFT的表面改性,根据改性条件观察到0.01-0.04cm〜2 / V / s的空穴迁移率。

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