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Verification of unzipping models of electromigration in gold nanocontacts by in situ high-resolution transmission electron microscopy

机译：通过原位高分辨率透射电子显微镜验证金纳米接触中电迁移的解压缩模型

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摘要

We observed in situ the electromigration process of gold (Au) nanocontacts (NCs) by high-resolution transmission electron microscopy. The structural dynamics of the interior and surfaces of the NCs were investigated at the atomic level. In particular, we directly verified the evidence of the unzipping model of electromigration with the in situ observation of surface-edge movement. The fundamental parameters of NCs, i.e., conductance and tensile force, were also measured during in situ lattice imaging of electromigration. Atoms migrating from the negative electrode accumulated at the most constricted regions of the NCs, leading to expansion. As a result, the NCs were compressed by the two electrodes. We demonstrated the magnitude of the force acting on the NCs during electromigration. The critical voltage of electromigration was approximately 80 mV, and the current density at the critical voltage was 60 TA m~(-2). We found that Au nanogaps could be fabricated by applying this bias voltage to Au NCs.
机译：我们通过高分辨率透射电子显微镜原位观察了金（Au）纳米触点（NCs）的电迁移过程。在原子水平上研究了NC的内部和表面的结构动力学。特别是，我们通过表面边缘运动的原位观察直接验证了电迁移解压缩模型的证据。在电迁移的原位晶格成像过程中，还测量了NC的基本参数，即电导率和拉力。从负极迁移的原子积聚在NC的最狭窄区域，从而导致膨胀。结果，NC被两个电极压缩。我们证明了在电迁移过程中作用在NC上的力的大小。电迁移的临界电压约为80 mV，临界电压下的电流密度为60 TA m〜（-2）。我们发现可以通过将该偏置电压施加到Au NCs来制造Au纳米间隙。

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