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Ultrahigh-density silicon nanobridges formed between two vertical silicon surfaces

机译:在两个垂直硅表面之间形成超高密度硅纳米桥

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We report simultaneous lateral growth of a high density of highly oriented, metal-catalyzed silicon nanowires on a patterned silicon substrate and bridging of nanowires between two vertical silicon sidewalls, which can be developed into electrodes of an electronic device. After angled deposition of catalytic metal nanoparticles on one of two opposing vertical silicon surfaces, we used a metal-catalyzed chemical vapour deposition process to grow nanowires and eventually form mechanically robust 'nanobridges'. The growth and bridging of these nanowire arrays can be integrated with existing silicon processes. This method of connecting multiple nanowires between two electrodes offers the high surface-to-volume ratio needed for nanosensor applications.
机译:我们报告在图案化的硅基板上高密度,高度定向的,金属催化的硅纳米线的同时横向生长以及两个垂直硅侧壁之间的纳米线桥接,可以将其发展为电子设备的电极。在两个相对的垂直硅表面之一上成角度沉积催化金属纳米颗粒后,我们使用了一种金属催化化学气相沉积工艺来生长纳米线,并最终形成机械坚固的“纳米桥”。这些纳米线阵列的生长和桥接可以与现有的硅工艺集成在一起。这种在两个电极之间连接多条纳米线的方法提供了纳米传感器应用所需的高表面积体积比。

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