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A nano-orthogonal cutting model based on a modified molecular dynamics technique

机译:基于改进的分子动力学技术的纳米正交切削模型

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A proposed method based on combining the concepts of shape functions of the finite element method (FEM) and a molecular dynamics (MD) technique was developed to evaluate the chip formation and strain and stress distribution in the cutting of single-crystal copper by a nano-scale mechanism. The displacement components for the atom in any temporary situation during the nano-scale cutting could be found. In this paper, the atom is regarded as a node and the lattice is regarded as an element. Using the atom displacements calculated by the MD program and combining the concepts of shape functions of FEM we calculate the equivalent strain for material deformation in the atomic-scale cutting mechanism. The equivalent stress was derived from the equivalent strain from the corresponding flow stress-strain curve, whereas the flow stress-strain curve was obtained from the regression of the stress-strain curve of a nano-copper thin film tension test simulation. In addition, the chip atoms within the diamond space were moved along the tool surface using a mathematical method. Also, this study introduced a new concept: 'a combined Morse potential function and rigid tool space restrictions criterion as the chip separation criterion' for the nano-scale cutting model.
机译:结合有限元方法(FEM)的形状函数和分子动力学(MD)技术的概念,提出了一种方法,用于评估纳米切割单晶铜时切屑的形成以及应变和应力分布规模机制。可以找到在纳米级切割过程中任何临时情况下原子的位移分量。在本文中,原子被视为节点,晶格被视为元素。使用由MD程序计算的原子位移,并结合FEM的形状函数概念,我们可以计算出原子尺度切削机理中材料变形的等效应变。等效应力是从相应的流动应力-应变曲线的等效应变中得出的,而流动应力-应变曲线是从纳米铜薄膜拉伸试验模拟的应力-应变曲线的回归中获得的。另外,使用数学方法使金刚石空间内的切屑原子沿刀具表面移动。此外,这项研究还引入了一个新概念:针对纳米级切削模型的“莫尔斯电势函数和刚性工具空间限制准则作为切屑分离准则”。

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