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首页> 外文期刊>Cardiovascular engineering >Design, fabrication and analysis of silicon hollow microneedles for transdermal drug delivery system for treatment of hemodynamic dysfunctions.
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Design, fabrication and analysis of silicon hollow microneedles for transdermal drug delivery system for treatment of hemodynamic dysfunctions.

机译：设计，制造和分析用于治疗血液动力学功能障碍的经皮药物输送系统的空心硅微针。

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摘要

In this paper, we present design, fabrication and coupled multifield analysis of hollow out-of-plane silicon microneedles with piezoelectrically actuated microfluidic device for transdermal drug delivery (TDD) system for treatment of cardiovascular or hemodynamic disorders such as hypertension. The mask layout design and fabrication process of silicon microneedles and reservoir involving deep reactive ion etching (DRIE) is first presented. This is followed by actual fabrication of silicon hollow microneedles by a series of combined isotropic and anisotropic etching processes using inductively coupled plasma (ICP) etching technology. Then coupled multifield analysis of a MEMS based piezoelectrically actuated device with integrated silicon microneedles is presented. The coupledfield analysis of hollow silicon microneedle array integrated with piezoelectric micropump has involved structural and fluid field couplings in a sequential structural-fluid analysis on a three-dimensional model of the microfluidic device. The effect of voltage and frequency on silicon membrane deflection and flow rate through the microneedle is investigated in the coupled field analysis using multiple code coupling method. The results of the present study provide valuable benchmark and prediction data to fabricate optimized designs of the silicon hollow microneedle based microfluidic devices for transdermal drug delivery applications.
机译：在本文中，我们介绍了带压电驱动微流体装置的空心面外硅微针的设计，制造和多场分析，该装置用于经皮药物输送（TDD）系统，用于治疗心血管疾病或血液动力学疾病，例如高血压。首先介绍了涉及深反应离子刻蚀（DRIE）的硅微针和储液罐的掩模版图设计和制造工艺。接下来是通过使用感应耦合等离子体（ICP）蚀刻技术的一系列组合的各向同性和各向异性蚀刻工艺来实际制造硅空心微针。然后介绍了基于MEMS的压电驱动装置与集成硅微针的耦合多场分析。与压电微泵集成的中空硅微针阵列的耦合场分析涉及到在微流体装置的三维模型上进行的顺序结构-流体分析中的结构和流场耦合。在使用多代码耦合方法的耦合场分析中，研究了电压和频率对硅膜挠度和通过微针流速的影响。本研究的结果提供了有价值的基准和预测数据，以制造用于透皮药物递送应用的基于硅空心微针的微流体装置的优化设计。

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