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首页> 外文期刊>Lab on a chip >Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices
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Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices

机译：基于焊料的芯片到管和芯片到芯片封装，用于微流控设备

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Constructing a microsystem compatible with a large variety of chemistries requires a system design that will be robust in the presence of different compounds and at a wide range of conditions. Although microreactors themselves can accommodate a great span of conditions, few packaging schemes are compatible with cryogenic temperatures, high pressures, and aggressive organic solvents. Solder-based connections are designed and implemented on silicon-based microreactors and are demonstrated to withstand elevated pressures ( up to 200 atm), a wide range of temperatures ( 278 to 160 degrees C) and a variety of solvent systems. Through the deposition of metal bonding pads directly onto silicon and glass surfaces, solder-based chip-to-tube connections can be reliably formed using handheld soldering tools. Packaging techniques are also described for fluidic chip-to-chip bonds, facilitating direct connection of microfluidic modules. This method greatly expands the utility of microfluidic reactors while enabling easy and reproducible fluidic packaging.
机译：构建与多种化学物质兼容的微系统需要一种系统设计，该系统设计在存在不同化合物且在各种条件下都将非常可靠。尽管微反应器本身可以适应各种条件，但很少有包装方案与低温，高压和腐蚀性有机溶剂兼容。基于焊料的连接是在基于硅的微反应器上设计和实现的，并被证明可以承受高压（最高200 atm），广泛的温度范围（278至160摄氏度）和各种溶剂系统。通过将金属焊盘直接沉积在硅和玻璃表面上，可以使用手持式焊接工具可靠地形成基于焊料的芯片对管连接。还描述了用于流体芯片对芯片结合的封装技术，以促进微流体模块的直接连接。该方法极大地扩展了微流体反应器的实用性，同时使流体包装变得容易和可重复。

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