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首页> 外文期刊>RSC Advances >Far infrared-assisted embossing and bonding of poly(methyl methacrylate) microfluidic chips
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Far infrared-assisted embossing and bonding of poly(methyl methacrylate) microfluidic chips

机译：聚甲基丙烯酸甲酯微流控芯片的远红外辅助压花和粘合

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摘要

Far infrared (IR) radiation was employed in the embossing and bonding of poly(methyl methacrylate) (PMMA) microfluidic chips owing to its high penetration ability and heating efficiency. To emboss a channel plate, a piece of PMMA plate was sandwiched between a template and a glass plate. They were exposed to IR radiation for 5 min at 130 degrees C under pressure in a far IR-assisted embossing/bonding system. Subsequently, the embossed channel PMMA plate was bonded with a PMMA cover plate with the aid of far IR radiation and pressure. Satisfactory bonding could be achieved within 3 min at 100 degrees C. The fabricated microchips were successfully employed in the electrophoretic separation of four nitroaromatic compounds. Far IR-assisted embossing and bonding approaches indicate great promise for the mass production of PMMA microchips at low cost and should find a wide range of applications.
机译：由于聚甲基丙烯酸甲酯（PMMA）微流控芯片具有很高的穿透能力和加热效率，因此它在压纹和粘合中采用了远红外（IR）辐射。为了压制通道板，将一块PMMA板夹在模板和玻璃板之间。在远红外辅助的压花/粘合系统中，将它们在130摄氏度的压力下暴露于红外辐射5分钟。随后，借助远红外辐射和压力，将压纹通道PMMA板与PMMA盖板粘合。在100摄氏度下3分钟之内可以实现令人满意的键合。所制造的微芯片已成功用于4种硝基芳族化合物的电泳分离。远红外辅助压花和粘合方法表明，以低成本批量生产PMMA微芯片具有广阔的前景，应找到广泛的应用。

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