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Fabrication of carbon nanofiber/Cu composite powder by electroless plating and microstructural evolution during thermal exposure

机译:碳纳米纤维/铜复合粉末的化学镀及热暴露过程中的微观结构演变

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摘要

Carbon nanofiber/Cu composite powder has been fabricated by electroless plating. The copper plates were deposited on the carbon nanofiber uniformly and densely. The copper particles were aggregated during the thermal exposure in vacuum and hydrogen in order to reduce surface energy. Thermal exposure of the composite in air leads to the spheroidization of the powder.
机译:碳纳米纤维/铜复合粉末已经通过化学镀制备。铜板均匀且致密地沉积在碳纳米纤维上。为了减少表面能,在真空和氢气中进行热暴露期间,铜颗粒聚集。复合物在空气中的热暴露导致粉末的球化。

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