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Reply to 'comments on ‘the brittle-to-ductile transition—I: A cooperative dislocation generation instability; II: Dislocation dynamics and the strain rate dependence of the transition temperature’'

机译:答复“关于脆性-韧性转变的评论:I:位错协同产生的不稳定性; II:位错动力学和转变温度对应变率的依赖性”

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摘要

Recently, Hirsch and Roberts (HR) [1] have commented on the model for the brittle-to-ductile transition (BDT) and its strain-rate dependence which was proposed by Khantha, Pope and Vitck (KPV) [2] and IChantha (MK), [3] respectively. HR conclude that,{he KPV-MK model predicts either a strain-rate independent sharp transition or a strain-rate dependent gradual transition for the case of silicon. Previously, tlie sharp strain-rate dependent BDT in Si, was modeled by Hirsch et al. [4,5] using a 'Dynamic Simulation Model' (DSM) for interacting dislocations with homogeneous distribution of dislocation sources along the crack front. Hirsch et al. [4,5] also examined separately the effect of heterogeneous sources along the crack front. HR maintain that a strain-rate dependent sharp transition can be obtained only by using a heterogeneous source model and not using the KPV-MK and DSM models based on homogeneous sources. In this paper, we begin with a brief summary of the KPV-MK and DSM models, address then the specific issues raised hi HR and demonstrate that their conclusions regarding the KPV-MK model are not warranted.
机译:最近,Hirsch和Roberts(HR)[1]评论了由Khantha,Pope和Vitck(KPV)[2]和IChantha提出的脆性-延性转变(BDT)模型及其应变率依赖性。 (MK),[3]。 HR得出结论,{对于硅,KPV-MK模型预测应变率独立的急剧转变或应变率相关的逐渐转变。以前,Hirsch等人模拟了硅中依赖于应变速率的尖锐的BDT。 [4,5]使用“动态模拟模型”(DSM)来使位错与沿裂纹前沿的位错源均匀分布的位错相互作用。 Hirsch等。 [4,5]还分别检查了沿裂纹前沿的非均质源的影响。 HR坚持认为,只能通过使用异构源模型而不是基于均质源的KPV-MK和DSM模型才能获得依赖于应变率的急剧转变。在本文中,我们首先简要介绍KPV-MK和DSM模型,然后解决人力资源部门提出的具体问题,并证明他们对KPV-MK模型的结论不正确。

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