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MEMS-based high-frequency vibration sensors

机译:基于MEMS的高频振动传感器

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We present the development of two vibration sensors, one designed for out-of-plane sensing and one designed for in-plane sensing. Both sensors, fabricated on a 5mm square MEMS (microelectromechanical system) chip, are variable capacitors with one electrode of the capacitor suspended by springs and the other electrode fixed to the chip. When a bias voltage is placed across the capacitor and the sensor is excited, the spring-suspended structure vibrates with respect to the fixed structure and induces a time-varying signal. Both sensors have resonant frequencies near 200kHz. The out-of-plane sensor employs an open grill design rather than square etch holes to reduce the effects of squeeze film damping and increase sensitivity. The in-plane sensor uses a finger-type design which attempts to take advantage of the relatively high damping effect of air in the out-of-plane direction in order to suppress unwanted out-of-plane motion. Finite element simulations estimating the resonant frequency are presented and compared to characterization measurements of the resonant frequency. Characterization measurements of the sensitivity of each device are also presented. In addition, we report on a laboratory experiment in which we measure the response of each sensor to steady-state excitation.
机译:我们介绍了两种振动传感器的开发情况,一种设计用于平面外传感,另一种设计用于面内传感。两个传感器均在5平方毫米的MEMS(微机电系统)芯片上制造,是可变电容器,电容器的一个电极被弹簧悬挂,另一个电极固定在芯片上。当在电容器两端施加偏置电压并激励传感器时,弹簧悬置结构相对于固定结构振动,并产生时变信号。两个传感器的谐振频率均接近200kHz。面外传感器采用开放式格栅设计,而不是方形蚀刻孔,以减少挤压膜阻尼的影响并提高灵敏度。平面内传感器使用手指型设计,该结构试图利用空气在平面外方向上的较高阻尼效果,以抑制有害的平面外运动。提出了估算谐振频率的有限元模拟,并将其与谐振频率的表征测量结果进行了比较。还介绍了每个设备灵敏度的特性测量。此外,我们报告了一项实验室实验,其中我们测量了每个传感器对稳态激励的响应。

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