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首页> 外文期刊>Smart Materials & Structures >Vibration attenuations induced by periodic arrays of piezoelectric patches connected by enhanced resonant shunting circuits
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Vibration attenuations induced by periodic arrays of piezoelectric patches connected by enhanced resonant shunting circuits

机译：由增强的谐振分流电路连接的压电贴片的周期性阵列引起的振动衰减

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摘要

Periodic arrays of piezoelectric patches connected by enhanced resonant shunting circuits are attached to a slender beam to control the propagation of vibration. Numerical models based on the transfer matrix methodology are constructed to predict the band structure, attenuation factors and the transmission of vibration in the proposed smart structure. The vibration attenuations of the proposed smart structure and that with the passive resonant shunting circuits are compared in order to verify the efficiency of the enhanced resonant shunting circuits. Vibration experiments are conducted in order to validate the theoretical predictions. The specimen with a combination of different types of resonant shunting circuits is also studied in order to gain wider attenuation frequency ranges.
机译：通过增强的谐振分流电路连接的压电贴片的周期性阵列连接到细长梁上，以控制振动的传播。构建基于传递矩阵方法的数值模型，以预测所提出的智能结构中的能带结构，衰减因子和振动传递。比较了所提出的智能结构和无源谐振分流电路的振动衰减，以验证增强型谐振分流电路的效率。进行振动实验以验证理论预测。为了获得更宽的衰减频率范围，还研究了具有不同类型谐振分流电路组合的标本。

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