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Electrodeposition of lead-free solder alloys

机译：无铅焊料合金的电沉积

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Purpose - The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)-free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach - The paper reviews the available reports on the electrodeposition of tin (Sn)-based solder systems and identifies the challenges in this area. Findings - Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near-desired alloy composition. Acidic plating baths are preferred due to their compatibility with photoresists but oxidation of stannous ions causes poor bath stability. Antioxidants, reducing agents and low oxygen over-potential anodes can suppress the oxidation rate and increase the lifespan of plating baths. Apart from chelating agents and antioxidants, various categories of additives can be added to improve quality of deposits. Surfactants, grain refiners and brighteners are routinely used to obtain smooth, fine-grained and bright deposits with good thermo-mechanical properties. Originality/value - The paper provides information on the key issues in electrodeposition of Pb-free solder alloys. Possible measures to alleviate the issues are suggested so that the electrodeposition technique can be established for mass production of a wider range of solder alloys.
机译：目的-本文的目的是增进对各种无铅（Pb）焊料合金电沉积的了解，以便可以进行新的研究来解决加工问题。设计/方法/方法-本文回顾了基于锡（Sn）的焊料系统电沉积的可用报告，并指出了该领域的挑战。发现-成分控制仍然是该领域的主要挑战，在该领域，二元和三元合金所需成分的实现存在不确定性。在浴中使用螯合剂和优化参数可以帮助实现几乎所希望的合金组成。优选酸性镀浴，因为它们与光致抗蚀剂相容，但是亚锡离子的氧化导致较差的浴稳定性。抗氧化剂，还原剂和低氧超电势阳极可抑制氧化速率并增加电镀液的使用寿命。除螯合剂和抗氧化剂外，还可添加各种添加剂以提高沉积质量。通常使用表面活性剂，晶粒细化剂和增白剂来获得具有良好热机械性能的光滑，细粒和光亮的沉积物。原创性/价值-本文提供了有关无铅焊料合金电沉积中关键问题的信息。提出了减轻这些问题的可能措施，以便可以建立电沉积技术以大规模生产更多种类的焊料合金。

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