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首页> 外文期刊>Soldering & Surface Mount Technology >Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints
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Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints

机译：Sn-8Zn-3Bi和Sn-37Pb焊点的低周疲劳测试和模拟

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Purpose - Sn-Zn based lead free solders with a melting temperature around 199℃ are an attractive alternative to the conventional Sn-Pb solder and the addition of bismuth improves its wetability. Whilst lead-free soldering with Sn-8Zn-3Bi has already been used in the electronics assembly industry, it is necessary to study its low cycle fatigue properties since such data have not been reported up to now. Design/methodology/approach - In this study, displacement-controlled low cycle fatigue testing of Sn-8Zn-3Bi and Sn-37Pb solder joints was done on lap shear samples. The test amplitude was varied whilst the frequency was kept constant at 0.2 Hz and failure was defined as a 50 per cent load reduction. Finite element (FE) modelling was used for analysis and the results were compared to the experimental data. Findings f The microstructure of the Sn-8Zn-3Bi solder showed a mixed phase of small cellular-shaped and coarser needle-shaped areas. Au-Zn intermetallic compounds were observed near the interface from the SEM-EDS observation. The average lifetime for the Sn-8Zn-3Bi solder joints was 17 per cent longer compared to the Sn-37Pb solder joints. The cross section observation indicated that the fatigue cracks propagated along the interface between thei solder bulk and the Au/Ni layer. The locations of maximum equivalent stress from the FE simulation were found to be at the two opposite corners of the solder joints, coinciding with the experimental observations of crack initiation. Originality/value - This is believed to be the first time, the low cycle fatigue properties of Sn-8Zn-3Bi solder have been reported.
机译：目的-熔化温度约为199℃的Sn-Zn基无铅焊料是传统Sn-Pb焊料的有吸引力的替代品，添加铋可改善其润湿性。尽管在电子组装行业中已经使用Sn-8Zn-3Bi进行无铅焊接，但是有必要研究其低循环疲劳性能，因为至今尚未报道此类数据。设计/方法/方法-在这项研究中，对搭接剪切样品进行了Sn-8Zn-3Bi和Sn-37Pb焊点的位移控制低循环疲劳测试。改变测试幅度，同时将频率保持恒定在0.2 Hz，并且将故障定义为负载减少50％。使用有限元（FE）建模进行分析，并将结果与​​实验数据进行比较。结果f Sn-8Zn-3Bi焊料的微观结构显示出小蜂窝状区域和针状区域较粗的混合相。通过SEM-EDS观察，在界面附近观察到Au-Zn金属间化合物。 Sn-8Zn-3Bi焊点的平均寿命比Sn-37Pb焊点的平均寿命长17％。横截面观察表明，疲劳裂纹沿着焊料块与Au / Ni层之间的界面扩展。通过有限元模拟得出的最大等效应力的位置位于焊点的两个相对角上，这与裂纹萌生的实验观察结果一致。独创性/价值-据信这是首次报道Sn-8Zn-3Bi焊料的低周疲劳性能。

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