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首页> 外文期刊>Ceramic Engineering and Science Proceedings >THROUGH THICKNESS MODULUS (E33) OF CERAMIC MATRIX COMPOSITES: MECHANICAL TEST METHOD CONFIRMATION
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THROUGH THICKNESS MODULUS (E33) OF CERAMIC MATRIX COMPOSITES: MECHANICAL TEST METHOD CONFIRMATION

机译：陶瓷基复合材料的厚度模量（E33）：机械测试方法确认

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摘要

Considering the interest in and challenges of using ceramic matrix composites, a full understanding of the physical properties is needed to continue to move the technology forward. A property of interest to the design process is the through thickness modulus of the composite. Most high performance CMC material systems are produced in a relatively thin state that hinders generation of test specimens that can easily be instrumented and tested in the through-thickness direction. Past work by the authors has shown that a stacked disk method could measure the through thickness modulus at various temperatures with sufficient accuracy. Due to the nature of the stacked disk, several testing issues were present and a model material system was chosen to alleviate testing concerns. A monolithic ceramic system was used to verify the test method by using the material in its monolithic state deploying the same stacked disk method. Results and conclusions of this verification effort will be discussed.
机译：考虑到使用陶瓷基复合材料的兴趣和挑战，需要对物理性能有一个全面的了解，才能继续推动该技术的发展。设计过程中感兴趣的特性是复合材料的贯穿厚度模量。大多数高性能CMC材料系统都是在相对较薄的状态下生产的，从而阻碍了试样的生成，而这些试样很容易在整个厚度方向上进行检测和测试。作者的过去工作表明，叠片法可以在各种温度下以足够的精度测量贯穿厚度模量。由于堆叠磁盘的性质，存在一些测试问题，因此选择了模型材料系统来缓解测试问题。单片陶瓷系统用于验证测试方法，方法是使用单片状态的材料并采用相同的堆叠磁盘方法。将讨论此验证工作的结果和结论。

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