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首页> 外文会议>International Conference on Advanced Ceramics and Composites >THROUGH THICKNESS MODULUS (E33) OF CERAMIC MATRIX COMPOSITES: MECHANICAL TEST METHOD CONFIRMATION
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THROUGH THICKNESS MODULUS (E33) OF CERAMIC MATRIX COMPOSITES: MECHANICAL TEST METHOD CONFIRMATION

机译：通过陶瓷基质复合材料的厚度模量（E33）：机械测试方法确认

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摘要

Considering the interest in and challenges of using ceramic matrix composites, a full understanding of the physical properties is needed to continue to move the technology forward. A property of interest to the design process is the through thickness modulus of the composite. Most high performance CMC material systems are produced in a relatively thin state that hinders generation of test specimens that can easily be instrumented and tested in the through-thickness direction. Past work by the authors has shown that a stacked disk method could measure the through thickness modulus at various temperatures with sufficient accuracy. Due to the nature of the stacked disk, several testing issues were present and a model material system was chosen to alleviate testing concerns. A monolithic ceramic system was used to verify the test method by using the material in its monolithic state deploying the same stacked disk method. Results and conclusions of this verification effort will be discussed.
机译：考虑到使用陶瓷矩阵复合材料的兴趣和挑战，需要完全了解物理性质，以继续向前移动技术。设计过程感兴趣的属性是复合材料的厚度模量。大多数高性能CMC材料系统以相对较薄的状态产生，阻碍可能在贯穿厚度方向上容易被仪器和测试的测试样本的产生。作者的过去的工作表明，堆叠磁盘方法可以在具有足够精度的各种温度下测量通过厚度模量。由于堆叠盘的性质，存在几个测试问题，选择了模型材料系统以减轻测试问题。使用单片陶瓷系统来验证测试方法，通过在其单片状态下部署相同的堆叠磁盘方法。将讨论此核查工作的结果和结论。

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