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Electrochemical reactions at a porphyrin-copper interface

机译:卟啉-铜界面的电化学反应

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摘要

The structure and reactivity of a Cu(100) single crystal electrode surface covered with free base meso-tetra (N-methyl-4-pyridinium) porphyrin (abbreviated as H2TMPyP) as a function of electrode potential have been investigated with cyclic voltammetry (CV), electrochemical scanning tunneling microscopy (ECSTM), and UV-Vis and Raman spectroscopy. The well-ordered self-assembled layer of the porphyrin is consistent with the adsorption of the reduced porphyrin species after the first two-electron reduction step. The copper dissolution reaction in the presence of the stable self-assembled porphyrin layer starts at step edges on both upper and lower terraces and coincides with the preferential oxidation of reduced porphyrin species at step sites. The dissolved copper cations are incorporated into the free base porphyrin molecules leading to the formation of CuTMPyP. As a consequence this new species accumulates in the solution with time and a copper redeposition in the cathodic potential scan is lacking.
机译:用循环伏安法(CV)研究了覆盖有游离碱中四(N-甲基-4-吡啶)卟啉(缩写为H2TMPyP)的Cu(100)单晶电极表面的结构和反应活性。 ),电化学扫描隧道显微镜(ECSTM)以及UV-Vis和拉曼光谱。卟啉的有序自组装层与在第一双电子还原步骤之后还原的卟啉种类的吸附一致。在稳定的自组装卟啉层存在下,铜的溶解反应始于上下平台的阶梯边缘,并与阶梯部位还原的卟啉物种的优先氧化相吻合。溶解的铜阳离子被掺入游离碱卟啉分子中,导致形成CuTMPyP。结果,这种新物质随时间积累在溶液中,并且在阴极电势扫描中缺乏铜的再沉积。

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