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首页> 美国政府科技报告 >Fabrication Process Changes for Performance Improvement of a RF MEMS Resonator: Conformable Contact Lithography, Moire Alignment, and Chlorine Dry Etching
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Fabrication Process Changes for Performance Improvement of a RF MEMS Resonator: Conformable Contact Lithography, Moire Alignment, and Chlorine Dry Etching

机译：RF mEms谐振器性能改进的制造工艺变化：适形接触光刻，莫尔条纹对准和氯干蚀刻

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This thesis presents fabrication process improvements for a RP MEMS resonator for the purpose of improving the quality factor (Q) and extending the frequency range. The process changes include the use of conformable contact lithography (CCL) and chlorine-based dry etching for improved fine-feature patterning and moire-based alignment techniques to allow for a non-self-aligned process. The resulting control over feature size and structure are expected to improve Q and enable higher frequency resonators. A CCL process utilizing moire alignment marks is described. An automated moire-based alignment system using Labview software is presented which demonstrates sub-100 nm alignment accuracy for a single alignment mark. A full-water alignment experiment is described that demonstrates average pattern placement errors of (back slash) 0.187 micrometers (back slash) and (back slash) 0.296 micrometers (back slash) for the x and y directions respectively. The experimental limitations are analyzed and suggested improvements to the system are detailed.

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