Printed Wiring Board Process Improvement. Final Report

机译：印刷线路板工艺改进。总结报告

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This project investigated ways of improving printed wiring board (PWB) fabrication at BKCD. The primary objective of the machining portion was to determine the best manufacturing techniques for rigid double-sided and multilayer printed wiring products, and to identify the process changes required to implement those techniques. Another objective was to improve solder thickness and shelf life by using the hot air leveling process. All process variables were identified and a suitable manufacturing process was established. Copper plating of PWBs presently uses a solution of copper pyrophosphate that has several disadvantages. The properties of the copper deposit from an acid copper sulfate process and relative ease of chemical control offer advantages over the pyrophosphate process and are being evaluated for use. (ERA citation 10:039729)

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作者
Evans, M. E.; Gentry, F. L.;
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年度 1985
页码 1-31
总页数 31
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Printed Circuits; Copper; Design; Machining; Plating;

机译：印刷电路;铜;设计;机加工;电镀;

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1. Substrate-induced coagulation of carbon black on gelatine-modified printed wiring board surfaces Part 1. Gelatine adsorption on to printed wiring board surfaces [J] . Bele M., Besenhard JO., Ribitsch V., Colloids and Surfaces, A. Physicochemical and Engineering Aspects . 1998,第1期

机译：基质诱导的明胶改性印刷电路板表面上炭黑的凝结第1部分。明胶吸附到印刷电路板表面上
2. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压动态平行度对多层印刷线路板差异的影响-多层印刷线路板精密粘合技术的研究IV
3. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压机动态平行性对多层印刷线板差异的影响 - 多层印刷配线板精确粘合技术研究IV
4. High-density build-up wiring boards using conventional printed wiring boards process [C] . Itaya, S., Miyazawa, . 2001

机译：使用常规印刷线路板工艺的高密度积层线路板
5. Application of internal state variable models to thermal processing and reliability of plated through holes in printed wiring boards. [D] . Fu, Chia-Yu. 1999

机译：内部状态变量模型在印刷线路板的热加工和电镀通孔的可靠性中的应用。
6. Novel waste printed circuit board recycling process with molten salt [O] . Frank Riedewald, Maria Sousa-Gallagher 2015

机译：熔融盐回收废电路板的新工艺
7. Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Manufacturing Process of Printed Wiring Boards. [O] . Hiroharu KAMIYAMA 1993

机译：特殊问题/最近印刷布线板表面整理的趋势和未来评论。印刷配线板的制造工艺。
8. Printed wiring board solderability improvement. Final report. [R] . D. D. Jarrell 1991

机译：印刷线路板可焊性提高。总结报告。

Printed Wiring Board Process Improvement. Final Report

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