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Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale bythe IMaP Methodology

机译：通过Imap方法在晶圆尺度上测试mEms机械性能的集成平台

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A new instrument to accurately and verifiably measure mechanical propertiesacross an entire microelectromechanical systems (MEMS) wafer is under development. We have modified the optics on a conventional microelectronics probe station to enable three-dimensional imaging while maintaining the full working distance of a long working distance objective. This allows standard probes or probe cards to be used. We have proceeded to map out mechanical properties along a wafer column by the Interferometry for Material Property Measurement (IMaP) methodology. From interferograms of simple actuated cantilevers, out-of-plane deflection profiles at the nanometer scale are obtained. These are analyzed by integrated routines that extract basic mechanical properties such as Youngs modulus and cantilever curvature. Non-idealities such as support post compliance and beam take off angle are simultaneously quantified. Verifiability is achieved by comparing properties at multiple voltages. When the non-idealities are properly taken into account, we find that Youngs modulusE-161 GPa for polysilicon and is independent of wafer position. However, curvature and residual stress data correlate with wafer position.

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de Boer, M. P.; Smith, N. F.; Masters, N. D.; Sinclair, M. B.; Pryputniewicz, E.J.;
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年度 2001
页码 1-12
总页数 12
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Mechanical properties; Wafers; Integrated circuits; Microminaturization; Semiconductor devices; Fabrication; Algorithms; Test methods; Microstructure; Cantilever beams; Miniaturization; Optics; Nondestructive tests; Interferometry; Deflections;

机译：机械性能;晶圆;集成电路;微小型化;半导体器件;制造;算法;测试方法;微结构;悬臂梁;小型化;光学;无损检测;干涉测量;挠曲;

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1. CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties [J] . Pei-Zen Chang, Wan-Chun Chuang, Yuh-Chung Hu Sensors . 2012,第12期

机译：提取晶圆级机械性能的CMOS-MEMS测试键
2. High speed wafer scale bulge testing for the determination of thin film mechanical properties [J] . M. P. Orthner L. W. Rieth and F. Solzbacher Review of Scientific Instruments . 2010,第5期

机译：高速晶圆级凸起测试，用于确定薄膜机械性能
3. Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response [J] . Nuno Brito, Carlos Ferreira, Filipe Alves, Sensors . 2016,第9期

机译：利用电响应进行晶圆级MEMS测试和表征的数字平台
4. Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology [C] . Maarten P. de Boer, Norman F. Smith, Nathan D. Masters, Symposium on mechanical properties of structural films . 2001

机译：通过IMAP方法测试MEMS机械性能的集成平台
5. Integrated modeling of chemical mechanical planarization/polishing (CMP) for integrated circuit fabrication: From particle scale to die and wafer scales. [D] . Luo, Jianfeng. 2003

机译：用于集成电路制造的化学机械平面化/抛光（CMP）的集成模型：从微粒级到芯片级和晶圆级。
6. CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties [O] . Wan-Chun Chuang, Yuh-Chung Hu, Pei-Zen Chang 2012

机译：提取晶圆级机械性能的CMOS-MEMS测试键
7. Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology [O] . MP de Boer, NF Smith, ND Masters, -1

机译：通过IMAP方法测试MEMS机械性能的集成平台

Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale bythe IMaP Methodology

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