Using consumer IC packages in harsh high reliability applications

机译：在恶劣的高可靠性应用中使用消费类IC封装

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The improvements in purity of molding materials, the IC wafer passivation layers, and manufacturing quality have resulted over the last decade in extremely high reliability in commercial IC packages. In contrast the ceramic/hermetic package world is suffering from limited availability of the newest IC chips, higher cost, larger size, and decreasing quality and fewer manufacturing lines. Traditional manufacturing line qualification tests are a good start for conversion to commercial plastic parts. However, the use of standard sensitive test chips instead of product die is necessary to perform affordable, quantitative evaluations. These test chips have many integrated sensors measuring chemical, mechanical, thermal, and electrical degradation caused by manufacturing and the package environment. Besides visual, electrical test, and burn-in little has been documented on 100% nondestructive screening of plastic molded parts. Based on realistic process control and system engineer cultural expectations, user screening is necessary. Nondestructive tests of moisture and temperature excursion susceptibility are described.

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作者
Reber, C. A. ; Palmer, D. W.;
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年度 1994
页码 1-8
总页数 8
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Integrated Circuits; Reliability; Certification; Nondestructive Testing; Plastics; Quality Control; Service Life;

机译：集成电路;可靠性;认证;无损检测;塑料;质量控制;使用寿命;

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1. Thermo-Mechanical Reliability Tradeoffs for Deployment of Area Array Packages in Harsh Environments [J] . Pradeep Lall, Naveen Singh, Jeffrey C. Suhling, IEEE Transactions on Components and Packaging Technologies . 2005,第3期

机译：在恶劣环境中部署区域阵列封装的热机械可靠性折衷
2. High-temperature reliability of integrated circuit based on 4H-SiC MOSFET with Ni/Nb ohmic contacts for harsh environment applications [J] . Van Cuong Vuong, Ishikawa Seiji, Maeda Tomonori, Japanese journal of applied physics . 2020,第12期

机译：基于4H-SIC MOSFET的集成电路高温可靠性，具有苛刻环境应用的NI / NB欧姆触点
3. High-temperature reliability of Ni/Nb ohmic contacts on 4H-SiC for harsh environment applications [J] . Vuong Van Cuong, Ishikawa Seiji, Maeda Tomonori, Thin Solid Films . 2019,第JANa1期

机译：4H-SiC上Ni / Nb欧姆接触的高温可靠性，适用于恶劣环境
4. Reliability analysis of electronic assemblies using electrically conductive adhesive for high-reliability and Harsh environment applications [C] . Lecavelier des Etangs-Levallois A., Grivon A., Baudet D., 2014 Electronics System-Integration Technology Conference . 2014

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5. Thermomechanical properties of packaging materials and their applications to reliability evaluation for electronic packages. [D] . Ren, Wei. 2000

机译：包装材料的热机械性能及其在电子包装可靠性评估中的应用。
6. Estimating added sugars in US consumer packaged goods: An application tobeverages in 2007–08 [O] . Shu Wen Ng, Gregory Bricker, Kuo-ping Li, -1

机译：估计美国消费包装商品中的添加糖：2007-08年的饮料
7. Development of polymeric microelectronics packaging encapsulation for harsh environment applications [O] . Eric Jian Rong Phua -1

机译：用于苛刻环境应用的聚合物微电子包装封装的开发
8. Using consumer IC packages in harsh high reliability applications [R] . Reber, C. A., Palmer, D. W. 1994

机译：在恶劣的高可靠性应用中使用消费类IC封装

Using consumer IC packages in harsh high reliability applications

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