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Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS

机译：微机电系统（mEms）和COTs mEms的互连和封装

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摘要

MEMS quality and reliability challenges are discussed and needs for study in these areas are identified.

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作者
Ramesham, R.; Ghaffarian, R.;
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年度 2000
页码 1-14
总页数 14
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
FAILURE; MICROELECTROMECHANICAL SYSTEMS; PACKAGING; RELIABILITY; MEMS packaging interconnection failure mechanisms;

机译：失败;微电子机械系统;打包;可靠性; mEms封装互连故障机制;

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专利

1. Microstructure and mechanical properties of aluminum-germanium eutectic bonding with polysilicon metallization for microelectromechanical systems (MEMS) packaging [J] . Woo-Tae Park, Jin-Wook Jang, Troy Clare Scripta materialia . 2011,第8期

机译：微机电系统（MEMS）封装的铝-锗与多晶硅金属共晶键合的微观结构和力学性能
2. Design, fabrication, testing and packaging of a silicon micromachined radio frequency microelectromechanical series (RF MEMS) switch [J] . M S GIRIDHAR, ASHWINI JAMBHALIKAR, JIJU JOHN, Sadhana . 2013,第2期

机译：硅微加工射频微机电系列（RF MEMS）开关的设计，制造，测试和封装
3. Design, fabrication, testing and packaging of a silicon micromachined radio frequency microelectromechanical series (RF MEMS) switch [J] . M. S. GIRIDHAR, ASHWINI JAMBHALIKAR, JIJU JOHN, Sadhana: Academy Proceedings in Engineering Science . 2013,第2期

机译：硅微加工射频微机电系列（RF MEMS）开关的设计，制造，测试和封装
4. Challenges in interconnection and packaging of microelectromechanical systems (MEMS) [C] . Ramesham, R., Ghaffarian, Electronic Components Technology Conference, 2000. 2000 Proceedings. 50th . 2000

机译：微机电系统（MEMS）互连和封装方面的挑战
5. Packaging of two-dimensional microelectromechanical systems (MEMS) variable capacitors with liquid crystal polymer. [D] . Faheem, Faheem F. 2004

机译：用液晶聚合物包装二维微机电系统（MEMS）可变电容器。
6. A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging [O] . Zhenyu Luo, Deyong Chen, Junbo Wang, 2014

机译：基于晶圆级MEMS真空封装的具有全玻璃电互连的高Q共振压力微传感器
7. Approaches and Challenges of Engineering Implantable Microelectromechanical Systems (MEMS) Drug Delivery Systems for in Vitro and in Vivo Applications [O] . Ken-Tye Yong, Indrajit Roy, Rui Hu, 2012

机译：用于体外和体内应用的工程植入式微机电系统（mEms）药物输送系统的方法和挑战
8. Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS) [R] . Rameshan, R., Ghaffarian, R. 2000

机译：微机电系统（mEms）互连和封装面临的挑战

Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS

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