• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文OA文献 >MEMS-elementtivalmistuksen step cut -sahausprosessin karakterisointi
【2h】

MEMS-elementtivalmistuksen step cut -sahausprosessin karakterisointi

机译：MEMS元件制造的分步锯切工艺的表征

页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The goal of this research was to develop an optimized step cut chip dicing process for Murata Electronics Oy’s acceleration sensing element wafer through process characterization. There was an interest to find out how different process variables affect the process output and how these variables can be adjusted to achieve the best possible dicing quality. The most critical quality issue had been the appearance of large back side chipping.The characterization was carried out using a Design of Experiments (DOE) method to statistically analyse the effect of different variables. At first, a screening DOE was implemented to identify the most significant variables and then the process was fine-tuned with an optimization DOE. The input variables inspected in this research were blade type, step depth, feed rate and spindle speed. Outputs that were under interest were front side chipping, back side chipping, blade wear and spindle current. The chipping levels were evaluated with an optical microscope and an automated visual inspection device. Issues that were identified to lower the reliability of these results were the presence of uncontrollable factors, non-uniformity of the test material, lack of replicates and not inspecting the blade’s behaviour throughout its lifetime.Significant increase in dicing quality was achieved after process characterization and back side chipping levels were successfully reduced. The optimized step cut process was achieved with a metal bond blade, step depth 1/3, feed rate 7 mm/s, Z1 spindle speed 35 000 rpm and Z2 spindle speed 27 000 rpm. A shallower step depth, higher feed rate, lower spindle speed and a blade with softer bond material, larger grit size and lower concentration improved back side quality. Front side chipping in turn was reduced with a deeper step depth, lower feed rate and higher spindle speed. Blade wear and spindle current both increased by reducing spindle speed or increasing feed rate.An undesirable outcome for the step cut process was a poor cut accuracy of the first cut blade. To further improve the process a blade with a smaller outer diameter is recommended to prevent the blade edge from bending and to improve the cut accuracy. Also the effect of a different mounting tape to achieve even better back side quality and die stability during dicing is under high interest.
机译：这项研究的目的是通过工艺表征为Murata Electronics Oy的加速度感测元件晶圆开发一种优化的分步切割芯片切割工艺。有兴趣找出不同的过程变量如何影响过程输出以及如何调整这些变量以实现最佳的切割质量。质量方面最关键的问题是背面出现较大的缺口。使用实验设计（DOE）方法进行表征，以统计分析不同变量的影响。首先，实施筛选DOE以识别最重要的变量，然后使用优化DOE对过程进行微调。在这项研究中检查的输入变量是刀片类型，步长，进给速度和主轴速度。令人关注的输出是正面碎裂，背面碎裂，刀片磨损和主轴电流。用光学显微镜和自动视觉检查设备评估碎片水平。降低这些结果可靠性的问题是存在无法控制的因素，测试材料的不均匀性，缺乏重复性以及在刀片的整个使用寿命内都没有检查刀片的行为。在进行了工艺表征和加工后，切割质量得到了显着提高。背面切屑水平已成功降低。使用金属粘合刀片，阶梯深度1/3，进给速度7 mm / s，Z1主轴速度35000 rpm和Z2主轴速度27000 rpm可以实现最佳的阶梯切割工艺。较浅的台阶深度，较高的进给速率，较低的主轴转速以及具有较软粘结材料的刀片，较大的粒度和较低的浓度可改善背面质量。反过来，随着更深的台阶深度，更低的进给速率和更高的主轴转速，减少了前侧切屑。降低主轴转速或提高进给速度都会增加刀片的磨损和主轴电流。分步切割过程的不良结果是第一次切割刀片的切割精度较差。为了进一步改进工艺，建议使用外径较小的刀片，以防止刀片边缘弯曲并提高切割精度。同样令人关注的是，不同的安装胶带在切割过程中获得更好的背面质量和芯片稳定性的效果。

著录项

  • 作者

    Eklund Annina;

  • 作者单位
  • 年度 2015
  • 总页数
  • 原文格式 PDF
  • 正文语种 en
  • 中图分类

相似文献

  • 外文文献
  • 中文文献
  • 专利

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号