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Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation.

机译：sn-ag-Cu无铅钎料界面微观结构及焊料体积对金属间化合物层形成的影响。

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B. Salam; N. N. Ekere; D. Rajkumar;
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年度 2011
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1. The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure [J] . A. Zribi, A. Clark, L. Zavalij Journal of Electronic Materials . 2001,第9期

机译：Sn-Ag-Cu焊料/ Cu界面金属间化合物的生长以及焊料微结构的相关演变
2. The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al_2O_3 composite solder/Cu interface during soldering reaction [J] . S. Y. Chang, L. C. Tsao, M. W. Wu, Journal of materials science . 2012,第1期

机译：Sn-Ag-Cu钎料/ Cu和Sn-Ag-Cu-0.5Al_2O_3复合钎料/ Cu界面钎焊过程中金属间化合物的形貌和动力学演变
3. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging [J] . Xiong Ming-yue, Zhang Liang Journal of Materials Science . 2019,第2期

机译：电子包装中不同基板上的Sn-Ag-Cu无铅焊点的界面反应和金属间化合物生长行为
4. Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation [C] . Salam, B., Ekere, Electronic Components and Technology Conference, 2001. Proceedings., 51st . 2001

机译：Sn-Ag-Cu无铅焊料的界面微观结构及焊料量对金属间层形成的影响
5. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder. [D] . Werden, Jesse. 2016

机译：微合金化对Sn-Ag-Cu无铅焊料组织演变的影响。
6. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints [O] . Jenn-Ming Song, Bo-Chang Huang, David Tarng, 2020

机译：界面金属间化合物层纳米力学响应与焊点冲击可靠性的关系
7. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets [O] . Chen Guang, Wu Fengshun, Liu Changqing, 2016

机译：镀镍石墨烯纳米片增强的新型Sn-Ag-Cu无铅焊料的组织和性能

Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation.

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