CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT

• 1. 用于修整CMP垫的具有平且一致平面形貌的研磨工具及制造方法 [P] . 中国专利： CN102470505B . 2014.07.30
• 2. 具有混合研磨表面的CMP抛光垫修整器及其相关方法 [P] . 中国专利： CN101722475B . 2013.03.06
• 3. CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT [P] . 欧洲知识产权局专利： EP2845221B1 . 2017-09-20

  机译： 具有超研磨砂砾增强功能的CMP空调垫

• 4. CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT [P] . SG10201609257TA . 2016-12-29

  机译： 具有超研磨砂砾增强功能的CMP空调垫

• 5. CMP CONDITIONER PADS WITH SUPERABRASIVE GRIT ENHANCEMENT [P] . 欧洲知识产权局专利： EP2845221A1 . 2015-03-11

  机译： 具有超研磨砂砾增强功能的CMP空调垫

• 1. Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes [J] . Ji Chul Yang, Joo Hoon Choi, Taewook Hwang, International Journal of Machine Tools & Manufacture: Design, research and application . 2010,第10期
• 2. Diamond disc pad conditioning in chemical mechanical planarization (CMP): A surface element method to predict pad surface shape [J] . Z.C. Li, Emmanuel A. Baisie, X.H. Zhang Precision Engineering . 2012,第2期
• 3. Erratum to: 'Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions' [Microelect. Eng. 83 (2006) 362-370] [J] . Nam-Hoon Kim, Yong-Jin Seo, Woo-Sun Lee Microelectronic Engineering . 2007,第12期
• 4. The Pad Dressing Phenomena of Multiple Diamond Grits: Implications for The Design of CMP Pad Conditioners [C] . James C. Sung, Na-Lin Chen, Yang-Liang Pai, China semiconductor technology international conference 2010 . 2010
• 5. Nanoabrasives retention and removal mechanisms in polyurethane pads for copper CMP. [D] . Ul-hasan, Iftikhar. 2010
• 6. Hypoxic conditions increase hypoxia-inducible transcription factor 2α and enhance chondrogenesis in stem cells from the infrapatellar fat pad of osteoarthritis patients [O] . Wasim S Khan, Adetola B Adesida, Timothy E Hardingham 2007
• 7. Unwoven Fabric Pads Non-Destructive conditioning by High Pressure Micro Jet in CMP Process [O] . Keiji MIYACHI, Syuhei KUROKAWA, Toshiro DOI, 2010

• 1. Diamond breakage on CMP pad conditioner [J] . Liu Ping-Hsiao ,Sung James C. ,Hsu Kai-Hung . 金刚石与磨料磨具工程 . 2008,第S1期
• 2. Gemcitabine and Doxorubicin Combination Enhance the Cytotoxic Effect to Pancreatic Cancer Cells BxPC3 and PANC1 through UMP/CMP Kinase 1 [J] . Shuxian Chen ,Xu Wang ,Xianghui Ye . 生物科学与医学（英文） . 2017,第10期
• 3. 罗门哈斯推出高级化学机械研磨（CMP）专用新型VisonPad产品 [J] . . 工程塑料应用 . 2007,第9期
• 4. 罗门哈斯推出高级化学机械研磨(CMP)专用新型VISIONPAD产品 [J] . . 电子与电脑 . 2007,第8期
• 5. 罗门哈斯推出高级化学机械研磨(CMP)专用新型VISIONPAD^(TM)产品 [J] . . 电子工业专用设备 . 2007,第8期
• 6. 具有增强功能混凝土外养护剂的性能研究 [C] . Wang Binyun ,王斌云 ,Bao Weiping . CCPA预拌混凝土分会第七届“井冈山论坛” . 2020
• 7. 化学机械研磨(CMP)对电特性影响的分析与优化 [A] . 姜霖 . 2011