Cu ball, OSP-treated Cu ball, Cu core ball, solder joint, solder paste, foam solder, and manufacturing method of Cu ball

• 1. Cu球、经OSP处理的Cu球、Cu芯球、钎焊接头、焊膏、成形焊料和Cu球的制造方法 [P] . 中国专利： CN111386162B . 2021.06.18
• 2. Cu球、经OSP处理的Cu球、Cu芯球、钎焊接头、焊膏、成形焊料和Cu球的制造方法 [P] . 中国专利： CN111386162A . 2020-07-07
• 3. Cu BALL, OSP-TREATED Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND FOAM SOLDER, AND METHOD FOR MANUFACTURING Cu BALL [P] . KR20210049959A . 2021-05-06

  机译： Cu球，OSP处理的Cu球，Cu芯球，焊点，焊膏和泡沫焊料，以及制造Cu球的方法

• 4. Cu ball, OSP-treated Cu ball, Cu core ball, solder joint, solder paste, foam solder, and manufacturing method of Cu ball [P] . 韩国专利： KR1020200085350A . 2020.07.14
• 5. Cu BALL, OSP-TREATED Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND FOAM SOLDER, AND METHOD FOR MANUFACTURING Cu BALL [P] . 世界知识产权组织专利： WO2019111898A1 . 2019-06-13

  机译： 铜球，经OSP处理的铜球，铜芯球，焊点，焊锡膏和泡沫焊锡及其制造方法

• 1. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA) ASSEMBLY——PART Ⅰ: CREEP CONSTITUTIVE RELATION AND FATIGUE MODEL [J] . 史训清, 王志平, John HL Pang, 力学学报：英文版 . 2002,第003期
• 2. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA)ASSEMBLY--PART Ⅱ: RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION [J] . 史训清, John HL Pang, 杨前进, 力学学报：英文版 . 2002,第004期
• 3. Interfacial Reactions and Mechanical Properties of Ball-Grid-Array Solder Joints Using Cu-Cored Solder Balls [J] . HUEI-CHUAN LIN, HUEI-CHUAN LIN Journal of Electronic Materials . 2006,第11期
• 4. Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-AI(30 ppm)Solder Paste in a Lead-Free Wafer Level Chip Scale Package [J] . Huann-Wu Chiang, Jun-Yuan Chen, Jeffrey C.B.Lee, Journal of Electronic Materials . 2004,第12期
• 5. The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering [J] . Huang J. Q., Zhou M. B., Zhang X. P. Journal of Electronic Materials . 2017,第3期
• 6. EFFECT OF NI COATING OVER CU BALL ON THE MICROSTRUCTURE OF FLIP CHIP JOINTS WITH CU-CORED SOLDER BALLS [C] . Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, 2003 International Electronic Packaging Technical Conference and Exhibition; Jul 6-11, 2003; Maui, Hawaii . 2003
• 7. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders. [D] . Huang, Xingjia. 2003
• 8. Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration [O] . Wu Yue, Chao Ding, Hongbo Qin, 2021
• 9. Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages [O] . M. D. Cheng, S. Y. Chang, S. F. Yen, 2004

• 1. FORMATION AND CHANGE OF AuSn_4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING [J] . Y.H.Tian ,C.Q.Wang State Key Laboratory of Advanced Welding Production TechnologyHarbin Institute of TechnologyHarbin 150001China . 金属学报：英文版 . 2004,第2期
• 2. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls [J] . Yanhong TIAN Chunqing WANG Yarong CHEN . 材料科学技术：英文版 . 2008,第2期
• 3. Study on solder joint reliability of ceramic ball grid array component based on design of experiment method [J] . Wu Zhaohua ,Huang Chunyue ,Zhou Dejian . 中国焊接 . 2006,第003期
• 4. 以喷淋方式考察抗氧化护铜剂(OSP)的处理方法 [C] . 黎金明 ,杨斌 ,金祥哲 . 2010中日电子电路秋季大会暨秋季国际PCB技术/信息论坛 . 2010
• 5. 基于新型碳泡沫和多功能有机聚合物纳米球材料的样品前处理技术及其应用 [A] . 喻豪 . 2019