首页> 外国专利> Laser microdissection apparatus, analysis apparatus including laser microdissection apparatus, sample collection method, and device used in laser microdissection apparatus

Laser microdissection apparatus, analysis apparatus including laser microdissection apparatus, sample collection method, and device used in laser microdissection apparatus

机译:激光显微切割装置,包括激光显微切割装置的分析装置,样品收集方法以及在激光显微切割装置中使用的装置

摘要

The present invention addresses the problem of providing a laser microdissection apparatus having good operational efficiency. The laser microdissection apparatus, comprising sample movement means capable of retaining a slide, device movement means on which a device having a thermofusible film for transferring a sample can be mounted, a laser irradiation part for irradiating the sample with a dissection laser light, storage means for correlating and storing positional coordinates of the sample in the location irradiated by the dissection laser light and positional coordinates of the thermofusible film in a location where the collected sample is adhered, and a movement means drive control part for controlling driving of the sample movement means and the device movement means on the basis of the positional coordinates of the sample and the thermofusible film. The dissection laser light is radiated through the device onto the sample from below the device.
机译:本发明解决了提供具有良好操作效率的激光显微切割设备的问题。该激光显微切割装置包括:能够保持载玻片的样品移动装置;能够在其上安装有具有用于转印样品的热熔膜的装置的装置移动装置;用于向该样品照射解剖激光的激光照射部;存储装置。移动装置驱动控制部分,用于将由解剖激光照射的位置中的样本的位置坐标与粘附有收集的样本的位置中的热熔膜的位置坐标进行关联和存储;移动装置驱动控制部分,用于控制样本移动装置的驱动装置移动装置根据样品和热熔膜的位置坐标。解剖激光从设备下方通过设备辐射到样品上。

著录项

  • 公开/公告号US10627316B2

    专利类型

  • 公开/公告日2020-04-21

    原文格式PDF

  • 申请/专利号US201615564577

  • 发明设计人 MAKOTO SAWADA;

    申请日2016-04-06

  • 分类号G01N1/04;G01B21;G01N1/28;H01J49/04;G01N27/62;G01N1/06;

  • 国家 US

  • 入库时间 2022-08-21 11:29:55

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号