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Laser microdissection apparatus, analysis apparatus including laser microdissection apparatus, sampling method, and device used for laser microdissection apparatus
Laser microdissection apparatus, analysis apparatus including laser microdissection apparatus, sampling method, and device used for laser microdissection apparatus
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机译：激光显微切割装置，包括激光显微切割装置的分析装置，采样方法以及用于激光显微切割装置的装置
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摘要
The present invention addresses the problem of providing a laser microdissection apparatus having good operational efficiency. The problem can be resolved by means of a laser microdissection apparatus which includes: a sample moving means which holds a slide on which a sample has been placed, and which is capable of moving the sample slide in a horizontal direction and a vertical direction; a device moving means on which a device having a hot melt film for transferring samples can be placed, and which is capable of moving the device in a horizontal direction; a laser radiating unit for radiating dissection laser light onto the sample to excise the part of the sample onto which the dissection laser light has been radiated, and for causing said part of the sample to adhere to the hot melt film as a collected sample; a storing means which stores and associates with one another position coordinates of the part of the sample onto which the dissection laser light was radiated, and position coordinates of the part of the hot melt film to which the collected sample has adhered; and a movement means drive control unit which controls the drive of the sample moving means and the device moving means on the basis of the position coordinates of the sample and the position coordinates of the hot melt film, stored in the storing means. The dissection laser light is radiated onto the sample through the device, from below the device.
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