MEMS WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SMART CAP

• 1. 通过硅柱和智能帽实现晶圆级集成MEMS器件 [P] . 中国专利： CN109835865A . 2019-06-04
• 2. 一种MEMS器件的晶圆级封装方法及晶圆级封装结构 [P] . 中国专利： CN112624035A . 2021-04-09
• 3. MEMS WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SMART CAP [P] . 韩国专利： KR102148411B1 . 2020-08-27

  机译： 通过硅柱和智能电容实现的MEMS晶圆级集成MEMS器件

• 4. Wafer level integrated MEMS device enabled by silicon pillar and smart cap [P] . US10961118B2 . 2021-03-30

  机译： 晶圆级集成了MEMS设备，由硅柱和智能帽启用

• 5. Wafer level integrated MEMS device enabled by silicon pillar and smart cap [P] . 美国专利： US10556792B2 . 2020-02-11

  机译： 通过硅柱和智能电容实现晶圆级集成MEMS器件

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