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Measurement of overlay and edge placement errors with an electron beam column array
Measurement of overlay and edge placement errors with an electron beam column array
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机译：用电子束列阵列测量覆盖和边缘放置误差
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摘要
Methods and systems for performing measurements of multiple die with an array of electron beam columns are presented herein. The wafer is scanned in a direction parallel to the die rows disposed on the wafer. The electron beam measurement columns are spatially separated in a column alignment direction. The wafer is scanned in a direction that is oriented at an oblique angle with respect to the column alignment direction such that each electron beam column measures the same row of die features on different die during the same wafer pass. The wafer is oriented with respect to the array of electron beam columns by rotating the wafer, rotating the electron beam columns, or both. In further aspects, each measurement beam is deflected to correct alignment errors between each column and the corresponding die row to be measured and to correct wafer positioning errors reported by the wafer positioning system.
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