首页>
外国专利>
Measurement of overlay and edge placement errors using electron beam column arrays
Measurement of overlay and edge placement errors using electron beam column arrays
展开▼
机译：使用电子束柱阵列测量覆盖和边缘放置误差
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method and system for performing measurements of multiple dies using an array of electron beam columns is presented herein. The wafer is scanned in a direction parallel to the die rows disposed on the wafer. The electron beam measurement rows are spatially separated in the column alignment direction. The wafer is scanned in a direction oriented at an oblique angle to the column alignment direction such that each electron beam column measures the same row of die features on a different die during the same wafer pass. The wafer is oriented relative to the array of electron beam rows by rotating the wafer, rotating electron beam rows, or both. In a further aspect, each measurement beam is deflected to correct the alignment error between each column and the corresponding die row to be measured and to correct the wafer positioning error reported by the wafer positioning system.
展开▼
