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首页> 外国专利> Carrier and clip each having a sinterable solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding manufacturing method and use

Carrier and clip each having a sinterable solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding manufacturing method and use

机译：载体和夹具分别具有用于连接至半导体元件的可烧结的固化膏，相应的烧结膏，以及相应的制造方法和用途

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摘要

A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.
机译：在一个工作步骤中，通过使用固化的烧结浆料的烧结，通过将载体和夹子与芯片连接，来制造具有引线框架的包装。载体可以是引线框架，并且用于至少一个半导体元件的夹子具有用于连接至半导体元件的至少一个功能表面和多个连接。较早的或夹子的材料包括金属和由固化的烧结膏制成的层。烧结膏可包含银和/或银化合物。烧结膏布置在功能表面上。载体或夹子以及由烧结膏制成的层形成可以连接到半导体元件的中间产物。

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