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PACKAGING CHIP AND SIGNAL TRANSMISSION METHOD BASED ON PACKAGING CHIP
PACKAGING CHIP AND SIGNAL TRANSMISSION METHOD BASED ON PACKAGING CHIP
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机译：基于封装芯片的封装芯片和信号传输方法
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摘要
A packaging chip, comprising a packaging structure (160), a re-distribution structure (140), and a carrier (120). The packaging structure (160) comprises a first chip (1611) and a second chip (1612) adjacent to the first chip (1611); the re-distribution structure (140) is used for electrically connecting the first chip (1611) with the carrier (120), and is used for electrically connecting the second chip (1612) with the carrier (120); the re-distribution structure (140) comprises a main body made of an insulation material and a concave-convex soldered array (145) soldered to the lower surface of the main body; the interior of the main body is provided with a re-distribution metal wire group and an interconnection metal wire group (144) having a bending design; the carrier (120) is used for fixing the re-distribution structure (140), and the lower surface of the carrier (120) is provided with solder balls (180) or solder pads (180) or connectors (180); the upper surface of the main body of the re-distribution structure (140) is adhered to the lower surfaces of the first chip (1611) and of the second chip (1612); the concave-convex soldered array (145) of the re-distribution structure (140) is soldered to the upper surface of the carrier (120). The present invention can improve transmission reliability while ensuring a short signal path.
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