首页> 外国专利> MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICATING THE SAME

MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICATING THE SAME

机译：多自由度MEMS传感器芯片及其制造方法

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摘要

A single Micro-Electro-Mechanical System (MEMS) sensor chip is provided, for measuring multiple parameters, referred to as multiple degrees of freedom (DOF). The sensor chip comprises a central MEMS wafer bonded to a top cap wafer and a bottom cap wafer, all three wafer being electrically conductive. The sensor comprises at least two distinct sensors, each patterned in the electrically conductive MEMS wafer and in at least one of the top and bottom cap wafer. Insulated conducting pathways extend from electrical connections on the top or bottom cap wafers, through at least one of the electrically conductive top cap and bottom cap wafers, and through the electrically conductive MEMS wafer, to the sensors, for conducting electrical signals between the sensors and the electrical connections. The two or more distinct sensors are enclosed by the top and bottom cap wafers and by the outer frame of MEMS wafer.

机译：提供了单个微机电系统（MEMS）传感器芯片，用于测量多个参数，称为多个自由度（DOF）。传感器芯片包括结合到顶盖晶片和底盖晶片的中央MEMS晶片，所有三个晶片都是导电的。该传感器包括至少两个不同的传感器，每个传感器在导电MEMS晶片中以及在顶盖晶片和底盖晶片中的至少一个中被图案化。绝缘的导电路径从顶盖或底盖晶片上的电连接延伸，穿过导电顶盖和底盖晶片中的至少一个，并穿过导电MEMS晶片，到达传感器，以在传感器和传感器之间传导电信号。电气连接。两个或更多个不同的传感器被顶盖晶片和底盖晶片以及MEMS晶片的外框架包围。

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公开/公告号US2018074090A1

专利类型
公开/公告日2018-03-15

原文格式PDF
申请/专利权人 MOTION ENGINE INC.;
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申请/专利号US201615558807
发明设计人 ROBERT MARK BOYSEL;
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申请日2016-03-17
分类号G01P15/097;G01P15/08;G01P15/125;G01C19/574;G01C19/5712;G01C19/5769;B81B7;B81C1;G01L9;
国家 US
入库时间 2022-08-21 13:04:37

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