A chip type electronic component placement device (1) has an alignment hole (11) which is passed through a chip type electronic component (c) and is disposed in parallel with a printed circuit board (b), and a chip type electronic component (c), which is disposed parallel to the printed circuit board (b) A rod (41) is disposed on the printed circuit board (b) by pressing the alignment hole (11) through the alignment hole (11).The alignment hole (11) has an inner surface (12) into which the chip type electronic component (c) is fitted, and a hole (13) for guiding the chip type electronic component (c) toward the inner surface (12).
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