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Grown-in defect formation simulation method and a silicon single crystal manufacturing method based on the simulation method

机译:生长缺陷形成模拟方法和基于该方法的硅单晶制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method of simulating formation of Grown-in defects which can simulate formation of Grown-in defects being different depending on the oxygen concentration in a silicon single crystal and determine growth conditions so as to obtain a silicon single crystal with a desired defect size and a desired density.SOLUTION: A method of simulating formation of Grown-in defects formed during growing a silicon single crystal is characterized by calculating the completion time of formation of Void defects, one of the Grown-in defects, as the time of reaching the temperature at which the oxygen concentration in the silicone single crystal is oversaturated or the time after elapse of a specified time from the time of reaching the temperature at which the oxygen concentration in the silicon single crystal is oversaturated.
机译:解决的问题:提供一种模拟生长缺陷的形成的方法,该方法可以模拟根据硅单晶中的氧浓度而不同的生长缺陷的形成,并确定生长条件以获得硅单晶。解决方案:一种模拟在生长单晶硅期间形成的生长缺陷的形成方法,其特征在于,计算空缺缺陷(一种生长缺陷)的形成完成时间,达到硅单晶中的氧浓度过饱和的温度的时间,或者达到硅单晶中的氧浓度过饱和的温度的时间经过指定时间后的时间。

著录项

  • 公开/公告号JP6102631B2

    专利类型

  • 公开/公告日2017-03-29

    原文格式PDF

  • 申请/专利权人 信越半導体株式会社;

    申请/专利号JP20130168017

  • 发明设计人 星 亮二;菅原 孝世;

    申请日2013-08-13

  • 分类号C30B29/06;C30B15/20;

  • 国家 JP

  • 入库时间 2022-08-21 13:55:52

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