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REDUCING METHOD FOR GATE LEAKAGE CURRENT OF ALGAN/GAN HEMTS
REDUCING METHOD FOR GATE LEAKAGE CURRENT OF ALGAN/GAN HEMTS
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机译:降低Algan / GAN HEMTS门漏电流的方法
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摘要
The present invention relates to a method for reducing a gate leakage current of an AlGaN/GaN HEMT device and, more particularly, to a method for improving the gate leakage current, a feature below a threshold voltage, and a current attenuation phenomenon by applying an SF6 plasma process to the AlGaN/GaN HEMT. The method for reducing the gate leakage current of the AlGaN/GaN HEMT device according to the present invention includes the steps of: removing a SiNx pre-passivation layer deposited for protecting a GaN surface in an ohmic heat treatment of a high temperature after an ohmic process through the etching of the SF6 plasma process; processing the GaN surface; and re-depositing the SiNx passivation layer after an in-situ N2 plasma preprocess using ICP-CVD.
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机译:降低AlGaN / GaN HEMT器件的栅极泄漏电流的方法技术领域本发明涉及一种用于降低AlGaN / GaN HEMT器件的栅极泄漏电流的方法,更具体地,涉及一种通过施加电压来改善栅极泄漏电流,低于阈值电压的特征以及电流衰减现象的方法。 SF6等离子工艺制程于AlGaN / GaN HEMT。根据本发明的用于减小AlGaN / GaN HEMT器件的栅极泄漏电流的方法包括以下步骤:在欧姆化之后的高温欧姆热处理中,去除沉积的用于保护GaN表面的SiNx预钝化层。通过蚀刻SF6等离子工艺进行工艺;处理GaN表面;在使用ICP-CVD进行原位N2等离子体预处理之后,重新沉积SiNx钝化层。
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