Provided is a copper foil for use in a semiadditive method which, when laminated on a resin substrate and etched on the entire surface, has excellent adhesive force between a plating film and the etching surface of the resin substrate onto which the copper foil surface profile has been transferred. This copper foil comprises, in order, a copper foil bulk layer, a roughened layer, and a chrome-containing, anti-rust treated layer, wherein the copper foil is laminated onto the resin substrate from the side having the roughened layer, and, in the case of etching the entire surface of the copper foil using an etching liquid, when the etching surface of the resin substrate after the full-surface etching is subjected to surface analysis by XPS, then, defining the concentration by weight (wt%) of Cr, Zn, C, O and Si as A, B, C, D and E, respectively, the Cr content ratio (%) [=A/(A+B+C+D+E)×100] is 0.1-10%.
展开▼
机译：提供一种用于半添加法的铜箔，该铜箔层压在树脂基板上并在整个表面上进行蚀刻时，在镀膜与该铜箔表面轮廓所具有的树脂基板的蚀刻面之间具有优异的粘合力。已转移。该铜箔依次包括：铜箔块体层，粗糙化层和含铬防锈处理层，其中，从具有粗糙化层的一侧将铜箔层压到树脂基板上;在使用蚀刻液蚀刻铜箔的整个表面的情况下，当通过XPS对全表面蚀刻后的树脂基板的蚀刻表面进行表面分析时，以重量（wt％）定义浓度当Cr，Zn，C，O和Si分别为A，B，C，D和E时，Cr含量比[％] [= A /（A + B + C + D + E）×100]为0.1 -10％。
展开▼
