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Methods to improve electrical performance of ZrO2 based high-K dielectric materials for DRAM applications

机译:改善DRAM应用中基于ZrO2的高K电介质材料的电性能的方法

摘要

A method for reducing the leakage current in DRAM MIM capacitors comprises forming a multi-layer dielectric stack from an amorphous highly doped material, an amorphous high band gap material, and a lightly-doped or non-doped material. The highly doped material will remain amorphous (30% crystalline) after an anneal step. The high band gap material will remain amorphous (30% crystalline) after an anneal step. The lightly-doped or non-doped material will become crystalline (≧30% crystalline) after an anneal step. The high band gap material is formed between the amorphous highly doped material and the lightly or non-doped material and provides an intermediate barrier to conduction through the multi-layer dielectric stack.
机译:一种用于减少DRAM MIM电容器中泄漏电流的方法,其包括由非晶态高掺杂材料,非晶态高带隙材料以及轻掺杂或非掺杂材料形成多层电介质堆叠。在退火步骤之后,高掺杂材料将保持非晶态(<30%晶体)。在退火步骤之后,高带隙材料将保持非晶态(<30%晶体)。在退火步骤之后,轻掺杂或非掺杂材料将变为晶体(≥30%晶体)。高带隙材料形成在非晶态高掺杂材料与轻掺杂或非掺杂材料之间,并为穿过多层电介质叠层的导电提供中间阻挡层。

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