FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER CUTTING TECHNIQUES

• 1. 半导体晶片的保护结构、半导体晶片的保护方法以及所用的层压保护片和半导体晶片的加工方法 [P] . 中国专利： CN1321449C . 2007.06.13
• 2. 半导体晶片的保护结构、半导体晶片的保护方法以及所用的层压保护片和半导体晶片的加工方法 [P] . 中国专利： CN1679157A . 2005-10-05
• 3. Fabrication method for dicing of semiconductor wafers using laser cutting techniques [P] . 美国专利： US9287175B2 . 2016-03-15

  机译： 使用激光切割技术切割半导体晶片的制造方法

• 4. FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER CUTTING TECHNIQUES [P] . 美国专利： US2012115308A1 . 2012-05-10

  机译： 利用激光切割技术将半导体晶片切成小块的方法

• 5. Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same [P] . 美国专利： US7091624B2 . 2006-08-15

  机译： 通过使用激光切割技术分割半导体晶片而获得的半导体器件及其制造方法

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