TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC)

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• 3. Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC) [P] . 美国专利： US8421073B2 . 2013-04-16

  机译： 三维集成电路（3DIC）的硅通孔（TSV）的测试结构

• 4. Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC) [P] . 美国专利： US8956889B2 . 2015-02-17

  机译： 通过三维集成电路（3DIC）的硅VIAS（TSV）进行测试的方法

• 5. METHOD OF TESTING THROUGH SILICON VIAS (TSVS) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) [P] . 美国专利： US2013196458A1 . 2013-08-01

  机译： 通过三维集成电路（3DIC）的硅通孔（TSVS）进行测试的方法

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