首页> 外国专利> METHOD OF PRODUCING SURFACE-MODIFIED COPPER PARTICLE, METHOD OF PRODUCING COMPOSITION FOR FORMING CONDUCTOR, METHOD OF PRODUCING CONDUCTOR FILM, AND ARTICLE HAVING THE CONDUCTOR FILM

METHOD OF PRODUCING SURFACE-MODIFIED COPPER PARTICLE, METHOD OF PRODUCING COMPOSITION FOR FORMING CONDUCTOR, METHOD OF PRODUCING CONDUCTOR FILM, AND ARTICLE HAVING THE CONDUCTOR FILM

机译:表面改性铜粒子的制造方法,导体形成用成分的制造方法,导体膜的制造方法以及具有导体膜的物品

摘要

PROBLEM TO BE SOLVED: To provide: a method of producing copper particles that can form a conductor film having low volume resistivity; a method of producing a composition for forming a conductor; a method of producing the conductor film using the composition; and an article having the conductor film.;SOLUTION: A method of producing surface-modified copper particles includes: a step of dispersing the copper particles having an aspect ratio of 2.5 to 6 in a dispersion medium and of reducing the copper particles by a reaction system having pH of ≤3 and oxidation-reduction potential of 100-300 mV, thereby obtaining reduced copper particles; and a step of cracking the reduced copper particles to obtain the surface-modified copper particles having an average particle diameter D50 of ≤8.60 μm.;COPYRIGHT: (C)2012,JPO&INPIT
机译:本发明要解决的问题是:提供一种能够形成体积电阻率低的导体膜的铜粒子的制造方法。生产用于形成导体的组合物的方法;使用该组合物制造导体膜的方法;解决方案:生产表面改性的铜颗粒的方法包括:将长径比为2.5到6的铜颗粒分散在分散介质中并通过反应还原铜颗粒的步骤。该体系的pH值为3,氧化还原电位为100-300mV,从而得到还原的铜颗粒。还原的铜粒子的裂化,得到平均粒径D50为8.60μm的表面改性铜粒子。(C)2012,JPO&INPIT

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